International Conference on Edible Food Packaging Applications ICEFPA on April 26-27, 2021 in Istanbul, Turkey

Submit Your Paper
International Conference on Edible Food Packaging Applications (ICEFPA) April 26, 2021 - Istanbul, Turkey
Edible food packaging
Edible and biodegradable food packaging
Active and smart edible packaging
Edible food packaging and sustainability
Edible food components
Materials and processing technologies
Nanotechnology and edible packaging
Application of bioactive compounds
Food packaging applications
Principles and practice
Eco-friendly technology
Edible films
Edible protein films
Edible food packaging industry
Green marketing strategy
Edible food packaging made from milk proteins
Antimicrobial packaging
Reducing packaging waste
Current applications
The future of edible packaging

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.
Description Price Date
Presenter Sign Up Fee EUR 350.00 Before March 25, 2021
Listener Sign Up Fee EUR 250.00 Before March 25, 2021